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MTS Advanced Packaging Lithography Process Engineering Closed

GlobalFoundries · Singapore · Full-time

10+ years Posted 02 Jul 2025
Closed

Quick Summary

  • Lead Litho module UMD process engineers to develop advance packaging process.
  • Report process key milestones to HOD to ensure project is on track.
  • Work with equipment team to improve process robustness and troubleshoot issues.

Job Insights

Time open
17 days
🔄
Times reposted
0 times

Full Description

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Introduction:

Giga Fab is seeking highly skilled and motivated Experienced Lithography Process Engineer to become part of our starting 300mm Advance Packaging Center, Singapore and leading the Unit Module Developent team to achieve the key milestones.

  

Job Responsibilities:

  • To lead Litho module UMD process engineers to develop advance packaging process. Ensure the new process qual lot operation smoothly.

  • To report the process key milestone to HOD to make sure project running on track.

  • To work with equipment team to improve the process robustness, troubleshooting any issue arises during process setup. To set up new requirements based on process needs.

  • To work with integration to improve the process stability and process margin, achieve good quality process and cost-effective production.

  • To with customer engineering team to have effective communication with customers.

  • Organize and provide training for engineers / AEs to transfer the process knowledge before running mass production.

  • To be able to backup Litho process section manager role when it’s needed.

Required Qualifications:

  • BS degree in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required

  • Relevant working experience in TSV etch, plasma dicing etch and bonding fabrication etch

Preferred Qualifications:

  • MSc/Degree in Electrical/Electronics/Mechanical/Chemical Engineering or Honors Degree in Physics/Chemistry

  • >10 years relevant experience with minimum 3 years advanced packaging experience

  • Excellent verbal and written communication skills

  • Strong interpersonal skills and ability to work effectively with different cultures.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

 

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