Principal Mechanical Engineer (Singapore, 02, SG, 539775)

POSITION SUMMARY: Responsible for the design, analysis, testing, and manufacturing support of mechanical components in power conversion and plasma source products.  Must be multi-faceted in all aspects of mechanical engineering and willing to take ownership of designs.  Most important areas of expertise are heat-transfer and materials science.  ESSENTIAL RESPONSIBILITIES: • Independently prepares detailed and optimized mechanical designs of high power electronics packaging and vacuum chambers. • Own the design and documentation of sheet metal, injection-molded, and machined parts. • Participates in a multi-disciplined design team and is active in supporting new platform development activities.  Design team interaction with Asia locations and within the US. • Makes mathematical calculations to determine dimensional and positional variation (tolerance stack-ups) for mechanical components. • Engineering simulation experience, including thermal, structure, and fluid-flow. • Experiment design and data acquisition, such as temperature measurements, stress/strain measurements. • Takes into account solid material properties, behaviors, and failure modes of: polymers, metals, and ceramics. • Design and carry-out experiments to assess component durability or performance. • Interacts with manufacturers to produce manufacturable and cost efficient parts. • Considers method of fabrication during the design process – including machining, grinding and forming – in order to produce a manufacturable, optimized design. • Provide guidance to Mechanical Designers and Drafters. • Participates in the manufacturing and re-work of prototype parts, including 3D printing. WORK ENVIRONMENT: • Work is split between a standard office environment, an engineering lab, and/or clean room.  10% travel to international destinations. SKILLS & EXPERIENCE: • Bachelor’s Degree in Mechanical Engineering or Materials Science. • Minimum of 5 years of related design experience. • Advanced knowledge of Solid Works or other 3D modeling software. • Must have a working knowledge of Geometric Dimensioning and Tolerancing per ANSI Y14.5. • Experience in thermal analysis, hand calculations, and engineering simulation software.  Ansys preferred. • Experience with plasma processing and manufacturing, knowledge of materials, purity, cleanliness required for semiconductor wafer processing. • Demonstrated experience with vacuum equipment as applied to plasma processing. • Knowledge of materials science to design parts to withstand harsh plasma environments. • Working knowledge of manufacturing process in metal machining, sheet metal, injection molding. • Expertise in thermal instrumentation and experimental design validation. • Prefer ability of scripting in Python or MatLab to support data acquisition and design simulation. • Prefer experience in developing anodization for corrosive atmospheres.